Our software platform helps hardware designers and physics simulation engineers explore, analyze, and optimize hardware systems, leveraging cutting-edge AI to deliver ultrafast, accurate physics intelligence within the realities of engineering design workflows.
Our first product bridges the gap between the accuracy & determinism of traditional simulation and the speed & scaling of AI, and is redefining how the world’s most advanced semiconductors are designed, verified, built, brought to market and integrated in complex systems.
Role OverviewAs a pivotal leader within our European Forward Deployment team, you will drive the adoption of Vinci’s platform among the region's top engineering organizations.
In this strategic role, you will build, mentor, and guide a high-performing team of thermal engineers dedicated to engaging prospective customers and demonstrating our software's transformative value.
As trusted technical advisors, you and your team will use deep simulation expertise to help enterprise customers validate and optimize complex, real-world designs.
Through these collaborative engagements, you will champion Vinci's value proposition by showing how our platform delivers systemic improvements in thermal performance, product reliability, and time-to-market.
Leveraging strong fundamentals in continuum mechanics, you will guide analyses of complex physical phenomena, including linear, geometric and material nonlinearities, and contact interactions.
Your team will evaluate critical factors such as warpage, stress evolution, thermal cycling, and reliability across advanced semiconductor devices, electronics packages, and wafer-scale systems.
You will work closely with customer engineering teams to understand their technical challenges, provide expert guidance, and clearly articulate Vinci’s capabilities in solving real-world problems.
You will also serve as a key feedback channel to product and engineering tea.