Reaching this scale requires increasingly reliable, manufacturable and integrated photonic hardware, making our Integrated Photonics team a key part of this journey.
About this position:You will join our Integrated Photonics team, working across Massy and Palaiseau at the interface between PIC design, characterization, packaging and system integration.
We are looking for a hands-on Photonic Packaging Engineer to take ownership of our packaging activities, improve existing processes and help make our PIC integration more reliable and reproducible.
Your first priority will be to contribute to ongoing packaging activities, develop and improve assembly processes, and troubleshoot integration challenges alongside our PIC design and characterization teams.
As you grow into the role, you will also have the opportunity to develop new packaging approaches, coordinate technical projects and contribute to building more structured and scalable packaging capabilities.
Why this role matters:Today, packaging activities involve several members of our team.
Having a dedicated engineer will help us accelerate ongoing developments, improve the reproducibility of our processes and strengthen the connection between PIC design, characterization and system integration.
As our PIC platforms evolve, your work will also contribute to developing new integration approaches and preparing our packaging processes for future scale-up.
RequirementsWhat will you do:Develop and improve photonic packaging processes:• Take ownership of ongoing packaging activities and improve existing processes.