We do this with our unique VIO™ technology, the only QPU architecture that breaks the hardware barriers that have held quantum computing back, unlocking the path to MegaQubit quantum processors.
With VIO, we are paving the way for the hyper-scale quantum computers that will change the world.
And delivering on that vision demands people who don’t shy away from tackling the hardest challenges of our time.
That’s where you come in! Join us as a RF/PCB Design Engineer to drive the physical realization of our next-generation 3D quantum hardware architecture - hardware that operates from room temperature down to millikelvin conditions inside a dilution refrigerator.
You will own the design of critical microwave components, create high-density cryo-compatible PCB layouts, and build novel packaging solutions for large-scale QPUs.
Working at the intersection of hardware and software, you'll also help streamline our development by embedding design processes into automated workflows.
What you'll be doingComponent & Mechanical Design: Design critical electromechanical components that form the chief interface of our QPUs and TWPAs.
You will work as part of the packaging team and interface closely with the Product design team.
Precision Engineering: Utilise CAD to design PCBs, silicon chip layout and PCB-to-chip interconnect within the vertical VIO architecture.
RF/Microwave Design: Solve complex challenges related to insertion loss, impedance matching, and cross-talk at the PCB and package levels.
Cryogenic Integration & Testing: Design for and validate performance across the full temperature range from room temperature to millikelvin — accounting for thermal cycling, differential contraction, and material behavior at cryogenic temperatures, and running cooldown/characterization tests in dilution refrigerators.
Your ProfileEducation: BSc or MSc in Electrical Engineer.