The OpportunityLumai's optical engine only works if the electronics around it hold up.
Our boards carry large FPGAs and custom ASICs, multi-gigabit links and fine-pitch packages, and they have to be laid out to tolerances that leave no room for guesswork.
This role takes the designs coming out of our hardware and SI/PI teams and turns them into manufacturable, high-layer-count boards.
The RoleYou will own board layout from schematic handoff to fabrication release.
That covers stackups and HDI structures, controlled-impedance routing, differential pairs, length and phase matching, BGA breakout for large fine-pitch devices, and the full manufacturing package: Gerber/ODB++, drill files, assembly drawings and fabrication notes.
You will also own the footprint and symbol libraries, the design rules and the CAD standards the rest of the team works to.
What is genuinely hard.
Signal integrity, power integrity, thermal and mechanical.
You will be the person who turns simulation output into layout rules and who can defend a stackup to a fabricator.
By month six, you will have taken at least one board through to fabrication release, set the libraries and design rules the team works from, and be the first point of contact for our fabricators and assembly houses.
What You'll DoLay out dense, high-layer-count PCBs from schematic through to fabrication release, using constraint-driven flows.
Implement controlled-impedance routing, differential pair and length/phase matching, and HDI structures including microvias, via-in-pad and back-drilling.
Plan BGA breakout and component placement for large FPGAs, custom ASICs and fine-pitch packages, balancing SI, PI, thermal and mechanical requirements.
Translate SI/PI and hardware constraints into layout rules, and iterate quickly with engineers on simulation fee.