We do this with our unique VIO™ technology, the only QPU architecture that breaks the hardware barriers that have held quantum computing back, unlocking the path to MegaQubit quantum processors.
With VIO, we are paving the way for the hyper-scale quantum computers that will change the world.
And delivering on that vision demands people who don’t shy away from tackling the hardest challenges of our time.
That’s where you come in! As a 3D Packaging Engineer, you will collaborate closely with our engineering team to physically realize our VIO products.
You will operate, adapt, and fine-tune high-precision assembly equipment to meet the precise tolerances required for optimal device performance.
What You'll Be DoingTooling Adaptation: Assist in modifying and calibrating high-precision assembly equipment (e.
, flip-chip bonders, die attach machines) to meet unique quantum 3D integration specifications.
Process Optimization: Help develop and refine placement and bonding processes (thermo-compression bonding, laser-assisted bonding, coldwelding) for non-standard substrates.
Test adhesives, glues, and solders to determine which materials survive extreme thermal cycling and cryogenic vacuum conditions.
3D Assembly Execution: Execute complex integration strategies, including multi-die stacking, interposer-based 3D architectures, and orthogonal (vertical) chip placement.
Your ProfileEducation: BS, MS, or PhD in Mechanical Engineering, Mechatronics, Physics, Materials Science, or a related field.
Tooling Experience: 3–5 years of hands-on experience operating and adjusting high-accuracy semiconductor assembly platforms.
Precision Assembly: Demonstrated experience achieving tight placement tolerances (around 1µm) in an R&D or pilot production environment.
3D Integration Knowledge: Solid foundational understanding of 3D integration (TSVs, micro-bumps, interposers) and h.